{"id":3774,"date":"2026-03-19T08:43:37","date_gmt":"2026-03-19T07:43:37","guid":{"rendered":"https:\/\/www-preprod.cnrs-imn.fr\/teams\/plasmas-and-thin-films\/pcm-modeling\/"},"modified":"2026-04-01T12:17:57","modified_gmt":"2026-04-01T10:17:57","slug":"pcm-modeling","status":"publish","type":"page","link":"https:\/\/www.cnrs-imn.fr\/en\/teams\/plasmas-and-thin-films\/pcm-modeling\/","title":{"rendered":"PCM modeling"},"content":{"rendered":"<div class=\"fusion-fullwidth fullwidth-box fusion-builder-row-1 fusion-flex-container has-pattern-background has-mask-background nonhundred-percent-fullwidth non-hundred-percent-height-scrolling\" style=\"--awb-border-radius-top-left:0px;--awb-border-radius-top-right:0px;--awb-border-radius-bottom-right:0px;--awb-border-radius-bottom-left:0px;--awb-flex-wrap:wrap;\" ><div class=\"fusion-builder-row fusion-row fusion-flex-align-items-flex-start fusion-flex-content-wrap\" style=\"max-width:1248px;margin-left: calc(-4% \/ 2 );margin-right: calc(-4% \/ 2 );\"><div class=\"fusion-layout-column fusion_builder_column fusion-builder-column-0 fusion_builder_column_3_4 3_4 fusion-flex-column equipe-thematique\" style=\"--awb-bg-size:cover;--awb-width-large:75%;--awb-margin-top-large:0px;--awb-spacing-right-large:2.56%;--awb-margin-bottom-large:20px;--awb-spacing-left-large:2.56%;--awb-width-medium:75%;--awb-order-medium:0;--awb-spacing-right-medium:2.56%;--awb-spacing-left-medium:2.56%;--awb-width-small:100%;--awb-order-small:0;--awb-spacing-right-small:1.92%;--awb-spacing-left-small:1.92%;\" data-scroll-devices=\"small-visibility,medium-visibility,large-visibility\"><div class=\"fusion-column-wrapper fusion-column-has-shadow fusion-flex-justify-content-flex-start fusion-content-layout-column\"><div class=\"fusion-text fusion-text-1\"><h2><img decoding=\"async\" class=\"alignnone wp-image-2780 size-full\" src=\"https:\/\/www.cnrs-imn.fr\/wp-content\/uploads\/2026\/03\/Modelisation_PCM.jpg\" alt=\"\" width=\"300\" height=\"215\" srcset=\"https:\/\/www.cnrs-imn.fr\/wp-content\/uploads\/2026\/03\/Modelisation_PCM-200x143.jpg 200w, https:\/\/www.cnrs-imn.fr\/wp-content\/uploads\/2026\/03\/Modelisation_PCM.jpg 300w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/><\/h2>\n<p><em>Overview of the multi-scale modeling approach<\/em><\/p>\n<p><strong>Researchers<\/strong>: Rim Ettouri [2023, -&gt;], Ahmed Rhallabi, Christophe Cardinaud, Marie Claude Fernandez, Aur\u00e9lie Girard, C\u00e9dric Mannequin [2022, -&gt;].<\/p>\n<p><strong>Contract researchers<\/strong>: Guillaume Le Dain [2018-2020], Jo\u00eblle Zgheib [2021-2023].<\/p>\n<p><strong>Contract engineer<\/strong>: Thomas le Pape [2023-2025],<\/p>\n<p><strong>Doctoral students<\/strong>: Tojo Rasoanarivo [2023-2026], Hamza Tarin [2023-2026], Coline Chartrain [2024-2027].<\/p>\n<p><strong>Doctoral students who have defended<\/strong>: Mickael Cosson (2021), Jo\u00eblle Zgheib (2021)<\/p>\n<p>The modeling activity developed within the PCM team aims to :<\/p>\n<ul>\n<li>Better understand the physico-chemical and electrical phenomena of low-pressure cold plasmas and their interactions with material surfaces<\/li>\n<li>Provide technologists with simulators capable of predicting the morphological properties of etched patterns or deposited thin films.<\/li>\n<li>Help optimize plasma processes for depositing and etching materials.<\/li>\n<\/ul>\n<p>The multi-scale approach developed enables us to predict the spatio-temporal evolution of etched patterns as a function of machine parameters. More recently, modeling activities have been extended to the simulation of the mechanisms involved in a sputtering discharge, with the aim of completing the approach using AI. <\/p>\n<p><strong>Key words<\/strong>: Plasma, etching, pulsed discharge, modeling, energy management<\/p>\n<p><strong>Collaborations<\/strong>: LS2N, IJL, GEM, GEPEA<\/p>\n<p><strong>Applications<\/strong>: Semiconductors, Microelectronics, anti-corrosion<\/p>\n<p><strong>Current or recent research projects<\/strong>: CIFRE (Modeling GaN etching using the ALE Cl2\/Ar <em>Atomic Layer Etching<\/em> process)<\/p>\n<p><strong>Joint thesis with UM6P and IETR<\/strong>: Gas sensor<\/p>\n<p><strong>ED Thesis<\/strong>: <em>Multi-scale plasma modeling in high-power pulse magnetron sputtering (HiPIMS)<\/em><\/p>\n<p><strong>Industrial project<\/strong>: Characterization<\/p>\n<h3><\/h3>\n<h3><\/h3>\n<h3><strong>1 &#8211; <\/strong><strong>Multi-scale modeling of plasma etching<\/strong><\/h3>\n<p><img decoding=\"async\" class=\"alignnone wp-image-2780 size-full\" src=\"https:\/\/www.cnrs-imn.fr\/wp-content\/uploads\/2026\/03\/Modelisation_PCM.jpg\" alt=\"\" width=\"300\" height=\"215\" srcset=\"https:\/\/www.cnrs-imn.fr\/wp-content\/uploads\/2026\/03\/Modelisation_PCM-200x143.jpg 200w, https:\/\/www.cnrs-imn.fr\/wp-content\/uploads\/2026\/03\/Modelisation_PCM.jpg 300w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/><\/p>\n<p><em>Overall diagram describing multi-scale modeling  <\/em><\/p>\n<p><strong>Researchers<\/strong> <em>:<\/em> Rim Ettouri [2023, -&gt;], Ahmed Rhallabi, Christophe Cardinaud, Aur\u00e9lie Girard, C\u00e9dric Mannequin [2022, Isabelle -&gt;]<\/p>\n<p><strong>Post-doctoral fellow <\/strong>: Guillaume Le Dain [2018-2020],<\/p>\n<p><em> <\/em><strong>Contract engineer:<\/strong> Thomas le Pape [2023-2025].<\/p>\n<p><strong>Doctoral student :<\/strong> Tojo Rasoanarivo [2023-2026]<\/p>\n<p>The etching of patterns reaching micron or even nanometric sizes is one of the key steps in the manufacture of integrated circuits, as well as in other miniature systems such as sensors or MEMS (Micro Electro Mechanical Systems). To better understand the physico-chemical mechanisms involved in etching, and to optimize the process, we have developed a multi-scale modeling approach to predict the time evolution of etching profiles as a function of machine parameters. This approach comprises three modules:<br \/>\n&#8211; a kinetic module to determine the densities and fluxes of neutral and charged species<br \/>\n&#8211; a sheath module to calculate the energy and angular distribution functions of ions.<br \/>\n&#8211; a surface module to determine the evolution of etched patterns through masks.<br \/>\nThis approach has been applied to silicon etching using the Bosch process, and to the etching of III-V materials and steel using chlorinated plasmas. These etching simulators are excellent tools to help technologists develop etching processes.   <\/p>\n<p><strong>Key words <\/strong>: Modeling, Etching, Plasma, Silicon, Steel, Bosch, ALE, GAN.<\/p>\n<p><strong>Expertise:<\/strong> Plasma discharge modeling, 2D modeling of plasma etching at mesoscopic and atomic scales, Monte-Carlo approach<\/p>\n<p><strong>Collaborations: <\/strong>Entreprise Semi-conducteurs, IJL Nancy<strong>, <\/strong>INSP<\/p>\n<p><strong>Current research projects: <\/strong>STMicroelectronics CIFRE project<\/p>\n<p><strong>Major publications:<\/strong><\/p>\n<p><a href=\"http:\/\/dx.doi.org\/10.1116\/6.0003932\" target=\"_blank\" rel=\"noopener\">Dynamic global model of <sub>Cl2\/Ar<\/sub> plasmas: Applicability to atomic layer etching processes.<\/a> <em><br \/>\nT. Rasoanarivo, C. Mannequin, F. Roqueta, M. Boufnichel and A. Rhallabi.<br \/>\nJournal of Vacuum Science &amp; Technology A 2024, 42, 063003<\/em><\/p>\n<p><a href=\"http:\/\/dx.doi.org\/10.1116\/6.0004464\" target=\"_blank\" rel=\"noopener\">Study of <sub>Cl2\/Ar<\/sub> transient plasmas using a dynamic global model.<\/a> <em><br \/>\n<\/em><em>T. Rasoanarivo, C. Mannequin, F. Roqueta, M. Boufnichel and A. Rhallabi.<br \/>\nJournal of Vacuum Science &amp; Technology A 2025, 43, 033008<\/em><\/p>\n<p><em>Etching of iron and iron-chromium alloys using ICP-RIE chlorine plasma.  <\/em><br \/>\n<em>G. Le Dain, F. Laourine, S. Guilet, T. Czerwiec, G. Marcos, C. Noel, G. Henrion,C. Cardinaud, A. Girard and A. Rhallabi, Plasma Sources Sci. Technol. 30, 095022 (2021).<\/em><\/p>\n<h3><strong>2<\/strong><strong> <\/strong><strong>&#8211; <\/strong><strong>Plasma discharge modeling for physical vapor deposition (PVD)<\/strong><\/h3>\n<h3><\/h3>\n<p><img decoding=\"async\" class=\"alignnone wp-image-2781 size-medium\" src=\"https:\/\/www.cnrs-imn.fr\/wp-content\/uploads\/2026\/03\/Modelisation_PCM2-300x194.jpg\" alt=\"\" width=\"300\" height=\"194\" srcset=\"https:\/\/www.cnrs-imn.fr\/wp-content\/uploads\/2026\/03\/Modelisation_PCM2-200x129.jpg 200w, https:\/\/www.cnrs-imn.fr\/wp-content\/uploads\/2026\/03\/Modelisation_PCM2-300x194.jpg 300w, https:\/\/www.cnrs-imn.fr\/wp-content\/uploads\/2026\/03\/Modelisation_PCM2-400x259.jpg 400w, https:\/\/www.cnrs-imn.fr\/wp-content\/uploads\/2026\/03\/Modelisation_PCM2.jpg 402w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/><\/p>\n<p><strong>Researchers<\/strong>: Rim Ettouri [2023, -&gt;], Ahmed Rhallabi, Pierre Yves Jouan, Post-doctoral researcher: Jo\u00eblle Zgheib [2021-2022]<\/p>\n<p><strong>Doctoral students<\/strong>: Jo\u00eblle Zgheib [2018-2021], Coline Chartrain [2024-2027].<\/p>\n<p>The emergence of the pulsed PVD process known as HiPIMS (High Power Impulse Magnetron Sputtering) has the advantage of improving the structural quality of deposited films. On the other hand, the auto-ionization phenomenon of the sputtered atoms makes the deposit more directional and consequently improves the step coverage of high-aspect-ratio structures (trenches, vias, etc.). These improvements are due to the application of a voltage of a few kilovolts on the cathode, with a duration of a few tens of microseconds and a frequency in the kilohertz range. To better understand the physical phenomena involved in this type of discharge, we are developing a global kinetic model applied to a chromium target bombarded by ions from an argon plasma discharge. The aim of the global model is to quantify the temporal evolution of the densities of neutral species from the gas and the target, as well as charged species. The study of the HiPIMS Ar\/Cr discharge could be adapted to other types of gas\/target mixtures for other types of thin-film deposition.     <\/p>\n<p>To this end, we are developing a global HiPIMS Ar\/Ti and Ar\/N\u2082\/Ti model in the ionization zone, with a view to the deposition of Ti and TiN thin films. This model will then be extended to the post-discharge in order to quantify the fluxes of active species arriving at the substrate surface. <\/p>\n<p><strong>Key words:<\/strong> Modeling, Simulation, PVD, HiPIMS, Thin films.<\/p>\n<p><strong>Expertise:<\/strong> Plasma discharge modeling, HiPIMS physics, Monte Carlo modeling<\/p>\n<p><strong>Major publications:<\/strong><\/p>\n<p><a href=\"http:\/\/dx.doi.org\/10.1116\/6.0000865\" target=\"_blank\" rel=\"noopener\">A high-power impulse magnetron sputtering global model for argon plasma-chromium target interactions.<\/a> <em><br \/>\nJoelle Zgheib, Pierre Yves Jouan and Ahmed Rhallabi.<br \/>\nJournal of Vacuum Science &amp; Technology A 2021, 39, 043004<\/em><\/p>\n<p>Modeling of ion transport from ionization region to entrance of mass spectrometer in HiPIMS argon\/Cr target<br \/>\n<em>J. Zgheib, P-Y. Jouan, A. Rhallabi, J. Vac. Sci. Technol. A 42, 033004 (2024).<\/em><\/p>\n<\/div><\/div><\/div><div class=\"fusion-layout-column fusion_builder_column fusion-builder-column-1 awb-sticky awb-sticky-small awb-sticky-medium awb-sticky-large fusion_builder_column_1_4 1_4 fusion-flex-column\" style=\"--awb-bg-size:cover;--awb-width-large:25%;--awb-margin-top-large:0px;--awb-spacing-right-large:7.68%;--awb-margin-bottom-large:20px;--awb-spacing-left-large:7.68%;--awb-width-medium:25%;--awb-order-medium:0;--awb-spacing-right-medium:7.68%;--awb-spacing-left-medium:7.68%;--awb-width-small:100%;--awb-order-small:0;--awb-spacing-right-small:1.92%;--awb-spacing-left-small:1.92%;--awb-sticky-offset:120px;\" data-scroll-devices=\"small-visibility,medium-visibility,large-visibility\"><div class=\"fusion-column-wrapper fusion-column-has-shadow fusion-flex-justify-content-flex-start fusion-content-layout-column\"><div class=\"fusion-text fusion-text-2\"><p><strong>Sub-themes<\/strong><\/p>\n<\/div><div class=\"awb-toc-el awb-toc-el--1\" data-awb-toc-id=\"1\" data-awb-toc-options=\"{&quot;allowed_heading_tags&quot;:{&quot;h3&quot;:0},&quot;ignore_headings&quot;:&quot;&quot;,&quot;ignore_headings_words&quot;:&quot;&quot;,&quot;enable_cache&quot;:&quot;yes&quot;,&quot;highlight_current_heading&quot;:&quot;yes&quot;,&quot;hide_hidden_titles&quot;:&quot;yes&quot;,&quot;limit_container&quot;:&quot;all&quot;,&quot;select_custom_headings&quot;:&quot;&quot;,&quot;icon&quot;:&quot;fa-flag fas&quot;,&quot;counter_type&quot;:&quot;none&quot;}\" style=\"--awb-item-padding-top:5px;--awb-item-padding-right:5px;--awb-item-padding-bottom:5px;--awb-item-padding-left:5px;--awb-item-font-family:&quot;Libre Franklin&quot;;--awb-item-font-style:normal;--awb-item-font-weight:400;\"><div class=\"awb-toc-el__content\"><ul class=\"awb-toc-el__list awb-toc-el__list--0\"><li class=\"awb-toc-el__list-item\"><\/li><li class=\"awb-toc-el__list-item\"><\/li><li class=\"awb-toc-el__list-item\"><a class=\"awb-toc-el__item-anchor\" href=\"#toc_1_Multiscale_modeling_of_plasma_etching\"><span>1 \u2013 <\/span><span>Multi-scale modeling of plasma etching<\/span><\/a><\/li><li class=\"awb-toc-el__list-item\"><a class=\"awb-toc-el__item-anchor\" href=\"#toc_2_Plasma_discharge_modeling_for_physical_vapor_deposition\"><span>2<\/span><span> <\/span><span>\u2013 <\/span><span>Plasma discharge modeling for physical vapor deposition (PVD)<\/span><\/a><\/li><li class=\"awb-toc-el__list-item\"><\/li><\/ul><\/div><\/div><\/div><\/div><\/div><\/div>\n","protected":false},"excerpt":{"rendered":"","protected":false},"author":3,"featured_media":0,"parent":3044,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"100-width.php","meta":{"footnotes":""},"class_list":["post-3774","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/www.cnrs-imn.fr\/en\/wp-json\/wp\/v2\/pages\/3774","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.cnrs-imn.fr\/en\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.cnrs-imn.fr\/en\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.cnrs-imn.fr\/en\/wp-json\/wp\/v2\/users\/3"}],"replies":[{"embeddable":true,"href":"https:\/\/www.cnrs-imn.fr\/en\/wp-json\/wp\/v2\/comments?post=3774"}],"version-history":[{"count":5,"href":"https:\/\/www.cnrs-imn.fr\/en\/wp-json\/wp\/v2\/pages\/3774\/revisions"}],"predecessor-version":[{"id":3811,"href":"https:\/\/www.cnrs-imn.fr\/en\/wp-json\/wp\/v2\/pages\/3774\/revisions\/3811"}],"up":[{"embeddable":true,"href":"https:\/\/www.cnrs-imn.fr\/en\/wp-json\/wp\/v2\/pages\/3044"}],"wp:attachment":[{"href":"https:\/\/www.cnrs-imn.fr\/en\/wp-json\/wp\/v2\/media?parent=3774"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}